DocumentCode
3441608
Title
Packaging of advanced computer components
Author
Kurzweil, Karel
Author_Institution
BULL S.A., Les Clayes-sous-Bois, France
fYear
1991
fDate
13-16 May 1991
Firstpage
805
Lastpage
810
Abstract
The main constraints and requirements on packaging and the techniques and technologies applied to meet the needs are presented. This includes the semiconductor devices assembly as well as the package and module construction in some of the current computers
Keywords
packaging; semiconductor device manufacture; computer components; packaging; semiconductor devices assembly; Clocks; Extrapolation; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Logic circuits; Propagation delay; Semiconductor device packaging; Semiconductor devices; System performance;
fLanguage
English
Publisher
ieee
Conference_Titel
CompEuro '91. Advanced Computer Technology, Reliable Systems and Applications. 5th Annual European Computer Conference. Proceedings.
Conference_Location
Bologna
Print_ISBN
0-8186-2141-9
Type
conf
DOI
10.1109/CMPEUR.1991.257494
Filename
257494
Link To Document