Title :
Packaging of advanced computer components
Author_Institution :
BULL S.A., Les Clayes-sous-Bois, France
Abstract :
The main constraints and requirements on packaging and the techniques and technologies applied to meet the needs are presented. This includes the semiconductor devices assembly as well as the package and module construction in some of the current computers
Keywords :
packaging; semiconductor device manufacture; computer components; packaging; semiconductor devices assembly; Clocks; Extrapolation; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Logic circuits; Propagation delay; Semiconductor device packaging; Semiconductor devices; System performance;
Conference_Titel :
CompEuro '91. Advanced Computer Technology, Reliable Systems and Applications. 5th Annual European Computer Conference. Proceedings.
Conference_Location :
Bologna
Print_ISBN :
0-8186-2141-9
DOI :
10.1109/CMPEUR.1991.257494
