DocumentCode
3441644
Title
High level CAD melds microsystems with foundries
Author
Karam, J.M. ; Courtois, B. ; Bauge, M.
Author_Institution
CMP, Grenoble, France
fYear
1996
fDate
11-14 Mar 1996
Firstpage
442
Lastpage
447
Abstract
Computer-aided-design (CAD) software is needed to design microsystems without excessive complexity and design time. Currently available CAD tools, such as Cadence DF2 or Mentor Falcon Framework, need modifications before they can be used for the automated design of micromachined devices. Work at the CMP has extended the capabilities of Cadence OPUS to microsystem technology. The user is able to generate layout of a microsystem including electronic and non-electronic parts in a commonly used format (GDS2, CIF), run an extended DRC which submits the layout to design rules checks in process aspects and electrical aspects and, finally, extract parameters from the layout level to the netlist level. The extended extractor recognises electronic components as well as microstructures, such as bridges, cantilevers and membranes. A netlist is generated and the simulation can be executed by the means of parametrized behavioural models of these microstructures. Finally, a parametrized cells library has been built. These advances are described in the paper
Keywords
CAD; digital simulation; electronic engineering computing; etching; micromachining; micromechanical devices; semiconductor process modelling; CAD software; CIF format; Cadence OPUS; GDS2 format; Si; automated design; bridges; cantilevers; computer-aided-design; design rules checks; extended extractor; high level CAD; layout generation; membranes; micromachined devices; microsystem design; netlist generation; parameters extraction; parametrized behavioural models; parametrized cells library; simulation; Biomembranes; Design automation; Etching; Foundries; Gas detectors; Mechanical sensors; Micromachining; Microstructure; Silicon; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
European Design and Test Conference, 1996. ED&TC 96. Proceedings
Conference_Location
Paris
ISSN
1066-1409
Print_ISBN
0-8186-7424-5
Type
conf
DOI
10.1109/EDTC.1996.494338
Filename
494338
Link To Document