DocumentCode
3442031
Title
Iddq testing for high performance CMOS-the next ten years
Author
Williams, T.W. ; Kapur, R. ; Mercer, M.R. ; Dennard, R.H. ; Maly, W.
Author_Institution
IBM Corp., Boulder, CO, USA
fYear
1996
fDate
11-14 Mar 1996
Firstpage
578
Lastpage
583
Abstract
CMOS scaling affects the subthreshold current per IC, and it directly impacts the utility of Iddq testing for CMOS devices. Continued IC manufacturing refinements enable a factor of √2 reduction in line widths every three years. This in conjunction with an increase in chip size makes it possible to increase the number of transistors per IC by a factor between two and three. This trend in CMOS technology is expected to continue over at least the next ten years. The scaling of devices affects numerous device parameters, one being the subthreshold current commonly known as the leakage current. Assuming defect size scales with technology, it will be explained why it will become increasingly difficult to differentiate good and defective devices based upon an Iddq test methodology
Keywords
CMOS integrated circuits; integrated circuit testing; leakage currents; production testing; technological forecasting; CMOS scaling; Iddq testing; device parameters; high performance CMOS; leakage current; line widths; manufacturing refinements; subthreshold current; test methodology; CMOS integrated circuits; CMOS technology; Integrated circuit testing; Leak detection; Leakage current; Manufacturing; Power supplies; Refining; Subthreshold current; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
European Design and Test Conference, 1996. ED&TC 96. Proceedings
Conference_Location
Paris
ISSN
1066-1409
Print_ISBN
0-8186-7424-5
Type
conf
DOI
10.1109/EDTC.1996.494359
Filename
494359
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