• DocumentCode
    3442031
  • Title

    Iddq testing for high performance CMOS-the next ten years

  • Author

    Williams, T.W. ; Kapur, R. ; Mercer, M.R. ; Dennard, R.H. ; Maly, W.

  • Author_Institution
    IBM Corp., Boulder, CO, USA
  • fYear
    1996
  • fDate
    11-14 Mar 1996
  • Firstpage
    578
  • Lastpage
    583
  • Abstract
    CMOS scaling affects the subthreshold current per IC, and it directly impacts the utility of Iddq testing for CMOS devices. Continued IC manufacturing refinements enable a factor of √2 reduction in line widths every three years. This in conjunction with an increase in chip size makes it possible to increase the number of transistors per IC by a factor between two and three. This trend in CMOS technology is expected to continue over at least the next ten years. The scaling of devices affects numerous device parameters, one being the subthreshold current commonly known as the leakage current. Assuming defect size scales with technology, it will be explained why it will become increasingly difficult to differentiate good and defective devices based upon an Iddq test methodology
  • Keywords
    CMOS integrated circuits; integrated circuit testing; leakage currents; production testing; technological forecasting; CMOS scaling; Iddq testing; device parameters; high performance CMOS; leakage current; line widths; manufacturing refinements; subthreshold current; test methodology; CMOS integrated circuits; CMOS technology; Integrated circuit testing; Leak detection; Leakage current; Manufacturing; Power supplies; Refining; Subthreshold current; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Design and Test Conference, 1996. ED&TC 96. Proceedings
  • Conference_Location
    Paris
  • ISSN
    1066-1409
  • Print_ISBN
    0-8186-7424-5
  • Type

    conf

  • DOI
    10.1109/EDTC.1996.494359
  • Filename
    494359