An opto-electronic multi-chip module for chip-scale interconnects

Author

Prather, D.W. ; Venkataraman, S. ; LeCompte, M.R. ; Campos, B. ; Kiamilev, F. ; Mait, J.N. ; Simonis, G.J.

Author_Institution

Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA

fYear

2001

fDate

11-11 May 2001

Firstpage

40

Lastpage

41

Abstract

Summary form only given. We have demonstrated an integrated optoelectronic MCM that uses a glass substrate as a mechanical carrier for the VCSEL, VCSEL driver, and diffractive element. Over a distance a little longer than 1 mm, our system fanned-out a single VCSEL into 60 individual fan-outs.

Keywords

chip scale packaging; diffractive optical elements; driver circuits; multichip modules; optical interconnections; semiconductor lasers; surface emitting lasers; 1 mm; VCSEL driver; chip-scale interconnects; diffractive element; fanned-out; glass substrate; individual fan-outs; integrated optoelectronic MCM; mechanical carrier; opto-electronic multi-chip module; single VCSEL; Ceramics; Fiber lasers; Integrated circuit interconnections; Laser modes; Optical receivers; Optical transmitters; Robots; Silicon; Transceivers; Wavelength division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 2001. CLEO '01. Technical Digest. Summaries of papers presented at the Conference on

Conference_Location

Baltimore, MD, USA

Print_ISBN

1-55752-662-1

Type

conf

DOI

10.1109/CLEO.2001.947436

Filename

947436