• DocumentCode
    3443636
  • Title

    380v/1.9A GaN power-HEMT: current collapse phenomena under high applied voltage and demonstration of 27.1 MHz class-E amplifier

  • Author

    Saito, Wataru ; Kuraguchi, Masahiko ; Takada, Yoshiharu ; Tsuda, Kunio ; Domon, Tomokazu ; Omura, Ichiro ; Yamaguchi, Masakazu

  • Author_Institution
    Toshiba Corp. Semicond. Co., Kawasaki
  • fYear
    2005
  • fDate
    5-5 Dec. 2005
  • Firstpage
    586
  • Lastpage
    589
  • Abstract
    The current collapse phenomena in 380V/1.9A GaN power-HEMTs designed for high-voltage power electronics application is reported. The influence of these phenomena to the power-electronics circuit performance under high applied voltage is discussed using a 27.1 MHz class-E amplifier, which can be one of an industrial application candidate. It has been found that the optimized field plate structure minimizes the increase of conduction loss caused by the current collapse phenomena and thus improves the power efficiency of the circuit. The minimized device achieved the output power of 13.8 W and the power efficiency of 89.6 % for the demonstrated circuit even with the applied drain voltage of 330 V and the switching frequency of 27.1 MHz. These results show the nature possibility of a new GaN-device application with both high voltage and high frequency condition
  • Keywords
    HEMT circuits; HF amplifiers; III-V semiconductors; gallium compounds; power HEMT; power amplifiers; wide band gap semiconductors; 1.9 A; 13.8 W; 27.1 MHz; 330 V; 380 V; GaN; class-E amplifier; conduction loss; current collapse phenomena; drain voltage; field plate structure; high-voltage power electronics; power efficiency; power-HEMT; power-electronics circuit; Aluminum gallium nitride; Circuits; Gallium nitride; HEMTs; High power amplifiers; MODFETs; Power electronics; Silicon; Switching frequency; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609415
  • Filename
    1609415