Title :
Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology
Author :
Chakraborty, S. ; Lim, K. ; Sutono, A. ; Chen, E. ; Yoo, S. ; Obatoyinbo, A. ; Laskar, J.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present the development of an integrated Bluetooth transceiver module using a commercial low temperature co-fired ceramic (LTCC) process. The developed module contains a power amplifier (PA), low noise amplifier (LNA), mixer, balun, band select filter and integrated antenna. The MMICs and passives are developed using a commercial 0.24 μm CMOS process and LTCC respectively. The power amplifier is capable of providing an output power of 20 dBm for the Bluetooth class 1 specification. To the best of our knowledge, this work presents the first report of module with integrated antennas
Keywords :
CMOS integrated circuits; MMIC mixers; MMIC power amplifiers; baluns; loop antennas; microwave antennas; microwave filters; mobile antennas; modules; transceivers; wireless LAN; 0.24 micron; Bluetooth class 1 specification; CMOS process; LNA; MMIC; balun; band select filter; integrated Bluetooth RF transceiver module; integrated antenna; loop antenna; low noise amplifier; low temperature co-fired ceramic; mixer; output power; package technology; power amplifier; wireless LAN; Band pass filters; Bluetooth; Ceramics; Impedance matching; Low-noise amplifiers; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Temperature; Transceivers;
Conference_Titel :
Radio and Wireless Conference, 2001. RAWCON 2001. IEEE
Conference_Location :
Waltham, MA
Print_ISBN :
0-7803-7189-5
DOI :
10.1109/RAWCON.2001.947550
