Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology

Author

Chakraborty, S. ; Lim, K. ; Sutono, A. ; Chen, E. ; Yoo, S. ; Obatoyinbo, A. ; Laskar, J.

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2001

fDate

2001

Firstpage

117

Lastpage

120

Abstract

We present the development of an integrated Bluetooth transceiver module using a commercial low temperature co-fired ceramic (LTCC) process. The developed module contains a power amplifier (PA), low noise amplifier (LNA), mixer, balun, band select filter and integrated antenna. The MMICs and passives are developed using a commercial 0.24 μm CMOS process and LTCC respectively. The power amplifier is capable of providing an output power of 20 dBm for the Bluetooth class 1 specification. To the best of our knowledge, this work presents the first report of module with integrated antennas

Keywords

CMOS integrated circuits; MMIC mixers; MMIC power amplifiers; baluns; loop antennas; microwave antennas; microwave filters; mobile antennas; modules; transceivers; wireless LAN; 0.24 micron; Bluetooth class 1 specification; CMOS process; LNA; MMIC; balun; band select filter; integrated Bluetooth RF transceiver module; integrated antenna; loop antenna; low noise amplifier; low temperature co-fired ceramic; mixer; output power; package technology; power amplifier; wireless LAN; Band pass filters; Bluetooth; Ceramics; Impedance matching; Low-noise amplifiers; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Temperature; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Conference, 2001. RAWCON 2001. IEEE

Conference_Location

Waltham, MA

Print_ISBN

0-7803-7189-5

Type

conf

DOI

10.1109/RAWCON.2001.947550

Filename

947550