• DocumentCode
    3444592
  • Title

    Design and Finite Element Analysis of Piezoresistive Cantilever with Stress Concentration Holes

  • Author

    Bhatti, Muhammad Akram ; Xi, Lee Chang ; Zhong, Lee Yue ; Abdalla, Ahmed N.

  • Author_Institution
    Huazhong Univ. of Sci. & Technol., Wuhan
  • fYear
    2007
  • fDate
    23-25 May 2007
  • Firstpage
    1171
  • Lastpage
    1174
  • Abstract
    We present a design and finite element analysis for piezoresistive cantilever sensor with stress concentration holes. As the magnitude of the forces involved is very small, increasing the sensitivity of the microcantilever sensors involved is a priority. In this paper we are considering to achieve this by structural variation of the cantilevers. Firstly the stress distributions and the vertical displacements of the designed cantilevers were simulated through ANSYS analyzing system. A paddle type cantilever with different number of holes modeled and simulated. The placement of the holes was found to be critical and results in improvements of piezoresistive displacement and force sensitivity, respectively. Then the relative resistance changes of the piezoresistors as a function of the cantilever vertical displacements were measured. As expected, the stresses are concentrated around the holes, which are higher than that of rectangular cantilevers under the same design and simulation parameters.
  • Keywords
    cantilevers; finite element analysis; microsensors; piezoresistive devices; stress analysis; ANSYS; finite element analysis; force sensitivity; forces magnitude; microcantilever sensors; paddle type cantilever; piezoresistive cantilever; stress concentration holes; vertical displacements; Analytical models; Biosensors; Chemical and biological sensors; Design engineering; Finite element methods; Force measurement; Force sensors; Piezoresistance; Stress; Structural beams;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications, 2007. ICIEA 2007. 2nd IEEE Conference on
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-0737-8
  • Electronic_ISBN
    978-1-4244-0737-8
  • Type

    conf

  • DOI
    10.1109/ICIEA.2007.4318591
  • Filename
    4318591