DocumentCode :
3444666
Title :
Enhanced lateral electromechanical coupling in lead-titanate-rod/polymer piezoelectric composites
Author :
Smith, Wallace Arden ; Shaulov, Avner A. ; Ting, Robert Y.
Author_Institution :
North American Philips Corp., Briarcliff Manor, NY, USA
fYear :
1988
fDate :
2-5 Oct 1988
Firstpage :
617
Abstract :
Although modified lead-titanate ceramics exhibit a negligible d31 piezoelectric coefficient, piezoelectric-rod/polymer-matrix composites made from them exhibit a substantial d31. A theoretical analysis shows that the composite´s enhanced d31 coefficient arises from lateral stress on the polymer phase being transferred to a longitudinal stress along the ceramic rods by the Poisson effect in the polymer, thus producing a charge through the ceramic´s d33. For hydrophone applications, this enhanced d31 suppresses the hydrostatic response so that the composite´s hydrophone figure of merit, dhgh, is less than that of the constituent ceramic. Nevertheless, the composite´s still substantial dhgh, high gh coefficient, remarkable pressure stability, low density, formability, and availability in thick sheets provide advantages for naval applications. In ultrasonic transducer applications, the composite structure provides no enhancement in electromechanical coupling, since the modified lead-titanate´s k33 is nearly the same as its kt. These expectations are in good agreement with measurements on 1-3 modified lead-titanate/polymer composites made by the dice-and-fill technique
Keywords :
composite materials; lead compounds; piezoelectric materials; polymers; ultrasonic transducers; PbTiO3; Poisson effect; ceramic; hydrophone; hydrostatic response; lateral electromechanical coupling; piezoelectric coefficient; piezoelectric composites; polymer; ultrasonic transducer; Ceramics; Composite materials; Lead; Polymers; Sonar equipment; Stress; Titanium compounds; Ultrasonic transducer arrays; Ultrasonic transducers; Ultrasonic variables measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/ULTSYM.1988.49451
Filename :
49451
Link To Document :
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