• DocumentCode
    3445309
  • Title

    35 nm floating gate planar MOSFET memory using double junction tunneling

  • Author

    Ohba, Ryuji ; Mitani, Yuichiro ; Sugiyama, Naoharu ; Fujita, Shinobu

  • Author_Institution
    Adv. LSI Technol. Lab., Toshiba Corp., Yokohama
  • fYear
    2005
  • fDate
    5-5 Dec. 2005
  • Firstpage
    853
  • Lastpage
    856
  • Abstract
    It is shown that, for 35 nm gate length, a silicon nitride trap memory using double junction tunneling can retain more than 4 decades memory window for 10 years in less than 9 volts w/e voltage, where 1E+6 w/e cycle endurance is attained simultaneously. This is due to Coulomb blockade and quantum confinement in Si nanocrystals lying between double tunnel oxides, and further improvement is possible by Si nanocrystal scaling. Therefore, the double junction tunneling SiN memory is an excellent candidate for less than 35nm region future memory
  • Keywords
    MOSFET; nanostructured materials; semiconductor storage; tunnelling; 35 nm; Coulomb blockade; SiN; double junction tunneling; double tunnel oxide; floating gate memory; planar MOSFET memory; quantum confinement; silicon nitride trap memory; Electron traps; Fabrication; MOSFET circuits; Nanocrystals; Nonvolatile memory; Potential well; Silicon compounds; Thickness control; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609491
  • Filename
    1609491