DocumentCode
3445309
Title
35 nm floating gate planar MOSFET memory using double junction tunneling
Author
Ohba, Ryuji ; Mitani, Yuichiro ; Sugiyama, Naoharu ; Fujita, Shinobu
Author_Institution
Adv. LSI Technol. Lab., Toshiba Corp., Yokohama
fYear
2005
fDate
5-5 Dec. 2005
Firstpage
853
Lastpage
856
Abstract
It is shown that, for 35 nm gate length, a silicon nitride trap memory using double junction tunneling can retain more than 4 decades memory window for 10 years in less than 9 volts w/e voltage, where 1E+6 w/e cycle endurance is attained simultaneously. This is due to Coulomb blockade and quantum confinement in Si nanocrystals lying between double tunnel oxides, and further improvement is possible by Si nanocrystal scaling. Therefore, the double junction tunneling SiN memory is an excellent candidate for less than 35nm region future memory
Keywords
MOSFET; nanostructured materials; semiconductor storage; tunnelling; 35 nm; Coulomb blockade; SiN; double junction tunneling; double tunnel oxide; floating gate memory; planar MOSFET memory; quantum confinement; silicon nitride trap memory; Electron traps; Fabrication; MOSFET circuits; Nanocrystals; Nonvolatile memory; Potential well; Silicon compounds; Thickness control; Tunneling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
Conference_Location
Washington, DC
Print_ISBN
0-7803-9268-X
Type
conf
DOI
10.1109/IEDM.2005.1609491
Filename
1609491
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