Development of low loss organic-micromachined interconnects on silicon at microwave frequencies

Author

Newlin, D. ; Pham, A. ; Harris, J. ; Lee, J.-B.

Author_Institution

Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA

fYear

2001

fDate

2001

Firstpage

181

Lastpage

183

Abstract

We present the design and development of organic micromachined structures on silicon (Si) at microwave/millimeter wave frequencies. The process employs an ultra-thick negative photoresist SU-8 that can be spun-coated and processed using standard lithography techniques. Using this process, we develop micromachined coplanar waveguide (CPW) interconnects on Si substrates. The micromachined grounded-CPW on Si (7.2 Ω-cm) achieves a measured insertion loss of 0.07 dB/mm and 0. 13 dB/mm at 10 GHz and 20 GHz, respectively

Keywords

coplanar waveguides; integrated circuit interconnections; integrated circuit packaging; micromachining; photolithography; silicon; 10 GHz; 20 GHz; CPW interconnects; SU-8 negative photoresist; Si; insertion loss; lithography; low loss organic-micromachined interconnects; micromachined coplanar waveguide; micromachined grounded-CPW; microwave frequencies; millimeter wave frequencies; silicon; Coplanar waveguides; Insertion loss; Integrated circuit interconnections; Lithography; Loss measurement; Microwave frequencies; Millimeter wave technology; Polymers; Resists; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Conference, 2001. RAWCON 2001. IEEE

Conference_Location

Waltham, MA

Print_ISBN

0-7803-7189-5

Type

conf

DOI

10.1109/RAWCON.2001.947597

Filename

947597