Title :
Amorphous-crystalline silicon interface prepared using DC saddle-field pecvd
Author :
Bahardoust, Barzin ; Chutinan, Alongkarn ; Blaine, Thomas ; Gougam, Adel B. ; Leong, Keith ; Yeghikyan, Davit ; Kosteski, Tome ; Kherani, Nazir P. ; Zukotynski, Stefan
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON, Canada
Abstract :
The DC saddle field glow discharge method was used to deposit a-Si:H in order to passivate c-Si surfaces. The process temperature and the thickness of the a-Si:H films were varied. In addition subsequent annealing of the samples were studied. Passivation quality of the a-Si:H overlayers were studied by measuring the effective minority carrier lifetime in the heterostructures as a function of the minority carrier density in the c-Si wafer. These results are then used to model the surface recombination mechanism in our samples. The defect density and the charge density at the interface are inferred which helps us to distinguish between the effects of electric field and chemical passivation at the interface. It is shown that for our intrinsic a-Si:H samples improvements in surface passivation are directly correlated with the reduction of interface defect density and field effect passivation is minimal. We have achieved surface passivation with effective carrier lifetime > 5 ms for a 40 nm intrinsic a-Si:H sample deposited at a process temperature of 200°C. It is also demonstrated that subsequent annealing, at 240°C, of the samples which were prepared at process temperatures < 240°C drastically increases the effective lifetime.
Keywords :
amorphous semiconductors; annealing; carrier lifetime; crystallisation; defect states; elemental semiconductors; glow discharges; hydrogen; minority carriers; passivation; plasma CVD; semiconductor growth; semiconductor heterojunctions; silicon; surface recombination; DC saddle field PECVD; Si:H; amorphous crystalline silicon interface; annealing; charge density; chemical passivation; defect density; field effect passivation; film thickness; glow discharge; minority carrier density; minority carrier lifetime; process temperature; semiconductor heterostructures; surface passivation; surface recombination; temperature 200 degC; temperature 240 degC; Annealing; Charge carrier density; Charge carrier lifetime; Density measurement; Glow discharges; Passivation; Semiconductor device modeling; Silicon; Surface discharges; Temperature;
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2009 34th IEEE
Conference_Location :
Philadelphia, PA
Print_ISBN :
978-1-4244-2949-3
Electronic_ISBN :
0160-8371
DOI :
10.1109/PVSC.2009.5411483