DocumentCode
3445905
Title
Method for solder bonding CPV receiver to heat sink
Author
Duckham, Alan ; He, Zhaojuan
Author_Institution
Reactive Nanotechnol., Hunt Valley, MD, USA
fYear
2009
fDate
7-12 June 2009
Abstract
This paper will describe a technology and process for providing reduced thermal resistance between CPV receivers and heat sinks, resulting in improved thermal performance and increased life span for the system.
Keywords
bonding processes; heat sinks; solar cells; solar energy concentrators; soldering; thermal resistance; CPV receiver; heat sink; solder bonding; thermal performance; thermal resistance; Bonding; Heat sinks;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2009 34th IEEE
Conference_Location
Philadelphia, PA
ISSN
0160-8371
Print_ISBN
978-1-4244-2949-3
Electronic_ISBN
0160-8371
Type
conf
DOI
10.1109/PVSC.2009.5411529
Filename
5411529
Link To Document