• DocumentCode
    3446313
  • Title

    A novel silicon-nitride based light-emitting transistor (SiNLET): optical/electrical properties of a SONOS-type three-terminal electroluminescence device for optical communication in ULSI

  • Author

    Yeh, C.C. ; Tsai, W.J. ; Lu, T.C. ; Chen, Y.R. ; Pan, F.M. ; Gu, S.H. ; Liao, Y.Y. ; Kao, H.L. ; Ou, T.F. ; Zous, N.K. ; Ting, WenChi ; Wang, Tahui ; Ku, Joseph ; Chih-Yuan Lu

  • Author_Institution
    Technol. Dev. Center, Macronix Int. Co.,Ltd, Hsinchu
  • fYear
    2005
  • fDate
    5-5 Dec. 2005
  • Firstpage
    1013
  • Lastpage
    1016
  • Abstract
    A novel silicon-nitride based light-emitting transistor (SiNLET) is proposed for the first time. This three-terminal electroluminescence device uses a SONOS-type device structure, and its process is compatible to standard CMOS devices. Photons are generated by Fowler-Nordheim electron (FN-E) tunnel-injection, band-to-band tunneling induced hot-hole (BTBT-HH) injection, and carrier scattering/trapping/recombination via nitride traps. SiNLET with an effective device area of 0.616 mum2 is demonstrated for display and optical communication purposes
  • Keywords
    ULSI; electric properties; electroluminescent devices; electron-hole recombination; hole traps; integrated optoelectronics; light emitting devices; optical interconnections; optical properties; photons; silicon compounds; tunnelling; BTBT-HH injection; CMOS devices; FN-E tunnel-injection; Fowler-Nordheim electron tunnel-injection; SONOS-type device structure; SONOS-type electroluminescence device; SiN; SiNLET; ULSI; band-to-band tunneling induced hot-hole injection; carrier recombination; carrier scattering; carrier trapping; electrical properties; nitride traps; optical communication; optical properties; silicon-nitride based light-emitting transistor; three-terminal electroluminescence device; CMOS process; Electroluminescent devices; Electron traps; Hot carriers; Light scattering; Optical devices; Optical fiber communication; Optical scattering; Tunneling; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609535
  • Filename
    1609535