Title :
Matching variation after HCI stress in advanced CMOS technology for analog applications
Author :
Lin, J.C. ; Chen, S.Y. ; Chen, H.W. ; Lin, H.C. ; Jhou, Z.W. ; Chou, S. ; Ko, J. ; Lei, T.F. ; Haung, H.S.
Author_Institution :
Special Technol. Div., United Microelectron. Corp., Hsinchu, Taiwan
Abstract :
In this report, hot carrier stress impact on mismatch properties of n and p MOS transistors with different sizes produced using 0.15 μm CMOS technology is presented for the first time. The research reveals that HCI does degrade matching of nMOSFETs´ properties, but, for pMOSFETs, the changes are minor. Due to matching variation after HCI stress, for analog circuits´ parameters, it is found that the after stress lines of n and pMOSFETs exhibit cross points for both σ (□ Vt,op) and σ (□Ids,op/Ids,op) drawings. It is suggested that the cross points can be used to indicate the minimal size for n and p pairs to have the same degree of mismatch in designing analog circuits. In addition, the interpretations for the differences in n to pMOSFETs and Ids,op to Ids,sat mismatches are provided with experimental verifications.
Keywords :
CMOS analogue integrated circuits; MOSFET; hot carriers; semiconductor device measurement; stress effects; 0.15 micron; HCI stress; MOS transistors; advanced CMOS technology; analog applications; analog circuits; hot carrier stress impact; nMOSFET; pMOSFET; Analog circuits; CMOS technology; Cities and towns; Current measurement; Degradation; Hot carriers; Human computer interaction; MOSFETs; Stress measurement; Threshold voltage;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2005 IEEE International
Print_ISBN :
0-7803-8992-1
DOI :
10.1109/IRWS.2005.1609575