DocumentCode
3447240
Title
Process induced charging damage in thin gate oxides
Author
Bersuker, Gennadi ; Werking, James ; Chan, David Y.
Author_Institution
SEMATECH, Austin, TX, USA
fYear
1996
fDate
20-23 Oct 1996
Firstpage
168
Abstract
Scaled devices require thinner gate oxides, and it is therefore important to estimate how such scaling affects oxide susceptibility to process induced charging damage. To address this issue, we used test structures that contain transistors with attached charge collecting antennas at different wafer processing levels. The sensitivity of transistor parameters to gate oxide characteristics allows for measurement of relatively low damage that may not show up in device yield
Keywords
MOSFET; semiconductor technology; LDD NMOS transistor; charge collecting antenna; device scaling; gate oxide; process induced charging damage effect; wafer processing; Antenna measurements; Charge measurement; Current measurement; Electron traps; Fuses; Leakage current; MOSFETs; Protection; Stress measurement; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop, 1996., IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-3598-8
Type
conf
DOI
10.1109/IRWS.1996.583407
Filename
583407
Link To Document