• DocumentCode
    3447240
  • Title

    Process induced charging damage in thin gate oxides

  • Author

    Bersuker, Gennadi ; Werking, James ; Chan, David Y.

  • Author_Institution
    SEMATECH, Austin, TX, USA
  • fYear
    1996
  • fDate
    20-23 Oct 1996
  • Firstpage
    168
  • Abstract
    Scaled devices require thinner gate oxides, and it is therefore important to estimate how such scaling affects oxide susceptibility to process induced charging damage. To address this issue, we used test structures that contain transistors with attached charge collecting antennas at different wafer processing levels. The sensitivity of transistor parameters to gate oxide characteristics allows for measurement of relatively low damage that may not show up in device yield
  • Keywords
    MOSFET; semiconductor technology; LDD NMOS transistor; charge collecting antenna; device scaling; gate oxide; process induced charging damage effect; wafer processing; Antenna measurements; Charge measurement; Current measurement; Electron traps; Fuses; Leakage current; MOSFETs; Protection; Stress measurement; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop, 1996., IEEE International
  • Conference_Location
    Lake Tahoe, CA
  • Print_ISBN
    0-7803-3598-8
  • Type

    conf

  • DOI
    10.1109/IRWS.1996.583407
  • Filename
    583407