• DocumentCode
    3448227
  • Title

    Moisture cross-linkable insulation compounds with flame retardant properties

  • Author

    Mahabir, C. ; Haridoss, S.

  • Author_Institution
    AT Plastics Inc., Brampton, Ont., Canada
  • fYear
    1993
  • fDate
    4-7 Oct 1993
  • Firstpage
    691
  • Lastpage
    696
  • Abstract
    Ethylene vinyl trimethoxy silane copolymer is shown to be suitable for flame retardant cable applications. A silane copolymer compound with 28% thermal black filler is shown to retain its melt flow rate by 90% when stored for a year at 23°C and 55% relative humidity. Cables of filled silane copolymer insulation are cured at 90°C in water, and at ambient temperature and humidity conditions. Equivalent properties are achieved whether the fillers are fully compounded with the copolymer or used in the form of a masterbatch. The extruded flame retardant cables are shown to have the fillers well dispersed in the polymer insulation to yield optimum flammability, tensile and dielectric properties. Statistical methods are used to compare the dielectric performance before and after a mechanical impact. The advantages and disadvantages of the silane copolymer technology over peroxide and radiation cross-linking technologies are discussed
  • Keywords
    cable insulation; 1 y; 23 degC; 90 degC; applications; cable insulation; cross-linkable insulation compounds; curing; dielectric performance; dielectric properties; ethylene vinyl trimethoxy insulation; extruded insulation; flame retardant properties; flammability; masterbatch; mechanical impact; melt flow rate; relative humidity; silane copolymer; tensile properties; thermal black filler; Cable insulation; Dielectrics and electrical insulation; Flame retardants; Flammability; Humidity; Moisture; Plastic insulation; Polymers; Statistical analysis; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition
  • Conference_Location
    Chicago, IL
  • ISSN
    1071-6270
  • Print_ISBN
    0-7803-0847-6
  • Type

    conf

  • DOI
    10.1109/EEIC.1993.631311
  • Filename
    631311