• DocumentCode
    3448718
  • Title

    Photovoltaic hot spot analysis for cells with various reverse-bias characteristics through electrical and thermal simulation

  • Author

    Kim, Katherine A. ; Krein, Philip T.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2013
  • fDate
    23-26 June 2013
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Hot spots result from localized heating in a string of photovoltaic (PV) cells due to mismatch that is often caused by partial shading or uneven degradation. Over time, this localized heating can result in permanent damage and degrade string performance. Bypass diodes are commonly employed in PV panels to mitigate this problem, but it does not eradicate the problem-hot spots can still form. This study investigates how the reverse-biased I-V characteristics and number of cells in series affect the potential for hot spotting. Using an electrical and thermal model in Matlab Simulink and Simscape, three distinct PV cells are modeled and simulated in various string lengths. Simulation results confirm that shorter strings reduce hot spot risk, but none of the cell types were immune to hot spotting, particularly in bypass. Bypassing even a short string can lead to hot spots and the temperature rise worsens as string length increases.
  • Keywords
    solar cells; thermal engineering; Matlab Simulink; PV cells; Simscape; bypass diodes; electrical simulation; hot spot risk reduction; localized heating; photovoltaic cells; photovoltaic hot spot analysis; reversebiased I-V characteristics; solar cells; string lengths; thermal simulation; Data models; Integrated circuit modeling; MATLAB; Mathematical model; Power dissipation; Temperature; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control and Modeling for Power Electronics (COMPEL), 2013 IEEE 14th Workshop on
  • Conference_Location
    Salt Lake City, UT
  • ISSN
    1093-5142
  • Print_ISBN
    978-1-4673-4914-7
  • Type

    conf

  • DOI
    10.1109/COMPEL.2013.6626399
  • Filename
    6626399