DocumentCode :
3449267
Title :
Modelling and performance of vertical trench MOSFET in power electronics
Author :
Morancho, F. ; Tranduc, H. ; Rossel, P. ; Charitat, G.
Author_Institution :
Lab. d´´Anal. et d´´Archit. des Syst., CNRS, Toulouse, France
fYear :
1995
fDate :
11-14 Oct 1995
Firstpage :
53
Lastpage :
56
Abstract :
In this paper, a family of SPICE models is proposed for the recently developed trench power MOSFET. Our modeling and parameter extraction approach is based on an analytical study, on two-dimensional device simulations and on experimental characterisation. Then, it is shown that regarding the total power losses, the trench MOSFET could be a device of choice, compared with classical high cell density vertical DMOSFET
Keywords :
SPICE; equivalent circuits; losses; power MOSFET; semiconductor device models; SPICE models; parameter extraction; power electronics; total power losses; two-dimensional device simulations; vertical trench MOSFET; Capacitance; Circuit simulation; Electric breakdown; MOSFET circuits; Performance loss; Power MOSFET; Predictive models; SPICE; Semiconductor device modeling; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 1995. CAS'95 Proceedings., 1995 International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-2647-4
Type :
conf
DOI :
10.1109/SMICND.1995.494862
Filename :
494862
Link To Document :
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