Title :
Delay factors for mainframe computers
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
In many modern machines, the package has become a major component of the delays that determine the system´s performance. The factors leading to this observation are discussed. Included in the discussion are all the path delay components, which encompass chip delay, propagation delay, loading delay, noise-induced delay, clock skews, and tolerances. Techniques for reducing these components in future mainframe designs are introduced. In addition, an argument that states the continuing need for bipolar-based mainframe technologies is given
Keywords :
delays; mainframes; packaging; bipolar-based mainframe technologies; chip delay; clock skews; loading delay; mainframe computers; noise-induced delay; package; path delay components; propagation delay; tolerances; CMOS technology; Central Processing Unit; Circuits; Computer aided instruction; Costs; Packaging machines; Propagation delay; Supercomputers; System performance; Workstations;
Conference_Titel :
Bipolar Circuits and Technology Meeting, 1991., Proceedings of the 1991
Conference_Location :
Minneapolis, MN
Print_ISBN :
0-7803-0103-X
DOI :
10.1109/BIPOL.1991.160968