Title :
Initiated plasma enhanced chemical vapor deposition (i-PECVD) of poly(alkyl acrylates)
Author :
Karaman, Mustafa ; Gursoy, Mehmet ; Ucar, Tuba ; Demir, Emrah ; Yenice, Ezgi
Author_Institution :
Dept. of Chem. Eng., Selcuk Univ., Konya, Turkey
Abstract :
Initiated plasma enhanced chemical vapor deposition (i-PECVD) is a novel technique that can produce well defined defect free polymeric films on many different substrates with low energy inputs. Although thin polymeric films could be formed using the solution based methods, the solvents used in such methods are not compatible for most of the fragile substrates and it causes major environmental problems. Fast deposition rates, high degree of functional group retention and conformal deposition are desired for most of the applications. In iPECVD, the chemical species called the initiator can easily be dissociated into reactive chemical species at low plasma powers due to their weak bonds. The basic reason behind the use of initiator in PECVD is to keep the plasma power low enough just to break the weak initiator bonds, so that the undesired monomer fragmentation ad chemical functionality lost would be avoided.
Keywords :
Fourier transform infrared spectra; X-ray photoelectron spectra; plasma CVD; plasma CVD coatings; polymer fibres; polymer films; scanning electron microscopy; surface morphology; thin films; FTIR; SEM; XPS; acrylic polymers; chemical functionality; chemical properties; coatings; conformal deposition; defect free polymeric thin films; dissociation; electrospun PMMA fibers; environmental problems; fragile substrates; fragile surfaces; frequency 13.56 MHz; functional group retention; i-PECVD; industrially important surfaces; initiated plasma enhanced chemical vapor deposition; inlet ports; low energy inputs; monomer fragmentation; morphological properties; paper surfaces; planar-coil antenna; plasma modification; plasma power; poly (hexafluorbutyl acrylate); poly(alkyl acrylates); poly(hydroxyethyl methacrylate); power 1 W; quartz window; reactant flow rates; reactive chemical species; solution based methods; substrate temperature; surface geometry; tert butyl peroxide; vacuum reactor; weak initiator bonds; Chemical vapor deposition; Chemicals; Films; Plasmas; Substrates; Surface morphology; Surface treatment;
Conference_Titel :
Plasma Sciences (ICOPS), 2015 IEEE International Conference on
Conference_Location :
Antalya
DOI :
10.1109/PLASMA.2015.7179962