Title :
Electromagnetic modeling of package parasitics in SAW-duplexer
Author :
Makkonen, Tapani ; Plessky, Victor P. ; Kondratiev, Sergei ; Salomaa, Martti M.
Author_Institution :
Micronas Semicond. SA, Bevaix, Switzerland
Abstract :
We model the inductive and capacitive parasitic electromagnetic couplings in a packaged surface-acoustic wave (SAW) antenna duplexer. Theoretical estimates for self- and mutual inductances of the bond wires are computed in the presence of two ground planes. An equivalent circuit for the duplexer including the parasitic elements is presented. The frequency response of the duplexer is predicted with the help of circuit simulation. The modeling is further refined with optimization of the model parameters to improve the fit between the measured and simulated responses
Keywords :
antenna accessories; circuit analysis computing; coupled mode analysis; equivalent circuits; frequency response; inductance; skin effect; surface acoustic wave devices; surface mount technology; 900 to 930 MHz; COM model; SAW antenna duplexer; SMD ceramic package; bond wires; capacitive parasitic electromagnetic coupling; circuit simulation; electromagnetic modeling; equivalent circuit; frequency response; ground planes; inductive parasitic electromagnetic coupling; model parameter optimization; mutual inductance; package parasitics; proximity effect; self-inductance; skin effect; Bonding; Circuit simulation; Electromagnetic coupling; Electromagnetic modeling; Equivalent circuits; Estimation theory; Packaging; Surface acoustic waves; Surface waves; Wires;
Conference_Titel :
Ultrasonics Symposium, 1996. Proceedings., 1996 IEEE
Conference_Location :
San Antonio, TX
Print_ISBN :
0-7803-3615-1
DOI :
10.1109/ULTSYM.1996.583777
