Fabrication of stress-induced self-rolled metal/insulator bifilm microtube with micromesh walls

A metal/insulator bifilm microtube with micromesh walls was constructed using a stress-assisted self-rolled-up technology. The Pt/Ti/SiO₂ microtube with mesh-sidewalls was self-formed by a tensile-stressed metal/insulator thin film through the release of planar micromesh from the silicon substrate by removing underlying sacrificial silicon structures. The metal pads interconnect electrically and support mechanically the freestanding self-rolled microtube. The electrical conductance was measured to show small thermal mass and good thermal isolation properties of the microtube. The diameter of self-rolled microtube is around 25 μm. The beam width and the size of micromesh walls were 0.6 μm and 5 μm, respectively. Thickness of Pt layer and SiO₂ layer was both 100 nm.