DocumentCode
3452765
Title
Silicon on Insulator CMOS with Hybrid Crystal Orientation Using Double Wafer Bonding
Author
Chan, K.K. ; Yang, M. ; Shi, L. ; Kumar, A. ; Ott, J.A. ; Patel, J. ; Schultz, R. ; Kry, H. ; Zhang, Y. ; Sikorski, E. ; Graham, W. ; To, B. ; Medd, S. ; Canaperi, D. ; Newbury, J. ; Scerbo, C. ; Meyer, R. ; Emic, C.D. ; Ieong, M.
Author_Institution
IBM Semiconductor Research and Development Center, Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598. Email: kkchan@us.IBM.com, Phone : (914)945-3166, Fax : (914)945-2141
fYear
2006
fDate
26-28 June 2006
Firstpage
41
Lastpage
42
Keywords
CMOS process; CMOS technology; Etching; Fabrication; Oxidation; Silicon on insulator technology; Substrates; Temperature; Voltage; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference, 2006 64th
Conference_Location
State College, PA, USA
ISSN
1548-3770
Print_ISBN
0-7803-9748-7
Type
conf
DOI
10.1109/DRC.2006.305110
Filename
4097527
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