DocumentCode
3452779
Title
Packageless SAW Devices with Isolated Layer Acoustic Waves (ILAW) and Waveguiding Layer Acoustic Waves (WLAW)
Author
Bhattacharjee, K. ; Shvetsov, A. ; Zhgoon, S.
Author_Institution
RF Micro Devices, Greensboro
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
135
Lastpage
140
Abstract
We report on two novel layered structure concepts and their acoustic wave properties for efficient, mechanically isolated, temperature compensated, and technologically attractive packageless SAW device applications as RF filters and duplexers. The piezoelectric substrate is covered with a layer of SiO2 or Pyrex that is in turn covered by a material of higher acoustical impedance creating an isolated layer acoustic wave (ILAW). Otherwise the wave inside a relatively low acoustic velocity waveguiding layer is confined by the higher velocity topmost layer made with high SAW velocity material thus ensuring the creation of waveguiding layer acoustic waves (WLAW). Modeling of acoustical properties of these waves (ILAW and WLAW) is confirmed by experimental results while useful figures of coupling, reflection and temperature stability are obtained. Extensive experiments with in-situ monitored depositions of multiple layers were performed and very good acoustical isolation of the waves was achieved.
Keywords
acoustic impedance; surface acoustic wave filters; Pyrex; RF filters; SiO2; acoustical impedance; acoustical isolation; duplexers; in-situ monitored depositions; isolated layer acoustic waves; mechanically isolated SAW device applications; packageless SAW devices; piezoelectric substrate; relatively low acoustic velocity waveguiding layer; temperature compensated SAW device applications; temperature stability; waveguiding layer acoustic waves; Acoustic materials; Acoustic waves; Filters; Isolation technology; Mechanical factors; Packaging; Piezoelectric materials; Radio frequency; Surface acoustic wave devices; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium, 2007 Joint with the 21st European Frequency and Time Forum. IEEE International
Conference_Location
Geneva
ISSN
1075-6787
Print_ISBN
978-1-4244-0646-3
Electronic_ISBN
1075-6787
Type
conf
DOI
10.1109/FREQ.2007.4319049
Filename
4319049
Link To Document