The effects of the interaction of normal force and wipe distance on contact resistance in precious metal plated contacts

Author

Brockman, Irvin H. ; Sieber, Charles S. ; Mroczkowski, Robert S.

Author_Institution

AMP Inc., Harrisburg, PA, USA

fYear

1988

fDate

26-29 Sept. 1988

Firstpage

73

Lastpage

83

Abstract

The effects of contact normal force and wiping distance on contact resistance were evaluated for hemispherical contacts wiping on flat coupons. Hard- and soft-gold-plated coupons and palladium and gold-over-palladium contacts were used. Two types of wiping action were investigated; wiping under the full normal force of 180 g and wiping during the application of the normal force. The coupon surface conditions used were: clean, lubricated, and lubricated and dust-covered. The lubricated and dust-covered conditions was intended to provide a severe condition for wiping action to penetrate or displace. The effects of cycling were also evaluated. In most cases it was found that wiping distances on the order of >

Keywords

electrical contacts; electronic equipment testing; materials testing; Au plated coupons; AuPd contacts; Pd contacts; clean contacts; contact resistance; coupon surface conditions; dry circuit conditions; dust-covered conditions; effects of contact normal force; effects of cycling; flat coupons; hemispherical contacts; lubricated contacts; lubricated dust covered contacts; penetrating action; precious metal plated contacts; severe condition for wiping action; wipe distance; wiping during load application; Circuits; Connectors; Contact resistance; Geometry; Gold; Palladium; Surface cleaning; Surface contamination; Surface finishing; Surface resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on

Conference_Location

San Francisco, CA, USA

Type

conf

DOI

10.1109/HOLM.1988.16099

Filename

16099