• DocumentCode
    3453813
  • Title

    Design and Use of Wafer Level Fluidic Packaging for Surface Acoustic Wave Sensors

  • Author

    Friedt, J.-M. ; El Fissi, L. ; Chérioux, F. ; Guichardaz, B. ; Blondeau-Patissier, V. ; Ballandras, S.

  • Author_Institution
    SENSeOR, Sophia Antipolis
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    369
  • Lastpage
    373
  • Abstract
    We demonstrate the propagation of a Love mode acoustic wave in a thin SU8 epoxy layer coating a AT-cut quartz substrate: the resulting insertion losses are observed in the -35 to -40 dB range. We demonstrate the packaging of this device in a SU8 microfluidic system preventing liquids from covering the interdigitated transducer while defining the chemical reaction area in the region between the interdigitated transducer. We demonstrate the ability to chemically functionalize the SU8 layer with amine-ended groups. Finally, a time-resolved adsorption of small (600 daltons) organometallic molecules is presented for illustrating the detection sensitivity and selectivity of the resulting sensor working with analytes in aqueous solutions.
  • Keywords
    microfluidics; semiconductor device packaging; surface acoustic wave sensors; AT-cut quartz substrate; Love mode acoustic wave; SU8 microfluidic system; amine-ended groups; chemical reaction area; insertion losses; interdigitated transducer; organometallic molecules; surface acoustic wave sensors; thin SU8 epoxy layer coating; time-resolved adsorption; wafer level fluidic packaging; Acoustic propagation; Acoustic sensors; Acoustic waves; Chemical transducers; Coatings; Insertion loss; Packaging; Surface acoustic wave devices; Surface acoustic waves; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium, 2007 Joint with the 21st European Frequency and Time Forum. IEEE International
  • Conference_Location
    Geneva
  • ISSN
    1075-6787
  • Print_ISBN
    978-1-4244-0646-3
  • Electronic_ISBN
    1075-6787
  • Type

    conf

  • DOI
    10.1109/FREQ.2007.4319099
  • Filename
    4319099