Title :
Thermal analysis experiences of a tri-core SoC system
Author :
Lung, Chiao-Ling ; Ho, Yi-Lun ; Huang, Shih-Hsiu ; Hsu, Chen-Wei ; Lia, Jia-Lu ; Huang, Si-Yu ; Chang, Shih-Chieh
Author_Institution :
Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
Higher temperature induced by higher power density results in higher cost, lower performance and lower reliability. The thermal effects become important issues of today´s VLSI design. In this paper, we adopt a RC-based thermal model to perform the steady-state and transient thermal analysis for a tri-core SoC system. The power information is generated from the ESL power estimation. The results show that the lateral heat dissipation cannot be ignored since hot spots occur in the vicinity where the nearby blocks with high power density, but none of hot spots with the highest power density. Finally, we also compare our fast RC based thermal analysis model with commercial CFD (Computational Fluid Dynamics) software whose runtime is extremely slow. The results show the high degree of consistency.
Keywords :
VLSI; computational fluid dynamics; electronic engineering computing; system-on-chip; thermal analysis; transient analysis; CFD software; ESL power estimation; RC based thermal analysis model; RC-based thermal model; VLSI design; computational fluid dynamics; lateral heat dissipation; power density; power information; steady-state analysis; transient thermal analysis; tri-core SoC system; Computational fluid dynamics; Costs; Performance analysis; Power generation; Power system modeling; Power system reliability; Steady-state; Temperature; Transient analysis; Very large scale integration; Computational Fluid Dynamics; DSP; ESL power Estimation; SoC; Steady-State Thermal Analysis; Thermal Model; Transient Thermal Analysis;
Conference_Titel :
Green Circuits and Systems (ICGCS), 2010 International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-6876-8
Electronic_ISBN :
978-1-4244-6877-5
DOI :
10.1109/ICGCS.2010.5542993
