Design and testing of a new MEMS contact element for microelectronic probing based on the buckling beam principle

Author

Schnaithmann, M. ; Sagebarth, J. ; Sandmaier, H. ; Vlachakis, P. ; Steidle, G. ; Weiland, A. ; Seekamp, J. ; Bohm, G. ; Schafer, Wilhelm

Author_Institution

Dept. of Microsyst., Univ. of Stuttgart, Stuttgart, Germany

fYear

2013

fDate

16-20 June 2013

Firstpage

574

Lastpage

577

Abstract

This paper presents the first report of a new MEMS contact element for microelectronic probing which can work with pitch sizes down to 30 μm, e.g. for memory line-on-center. With outer dimensions of 15 μm × 110 μm × 1.3 mm and 6 lamellae having a width of 10 μm, the system exerts a well defined contact force of 2 cN for an overtravel up to 70 μm, and thus competing with the mechanical limits of materials having extremely good mechanical properties.

Keywords

buckling; electrical contacts; integrated circuit design; integrated circuit testing; probes; MEMS contact element design; MEMS contact element testing; buckling beam principle; mechanical property; microelectronic probe; size 1.3 mm; size 10 mum; size 110 mum; size 15 mum; Contacts; Force; Materials; Numerical simulation; Probes; Safety; Stress; buckling beam; contact element; microelectronic probing;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on

Conference_Location

Barcelona

Type

conf

DOI

10.1109/Transducers.2013.6626831

Filename

6626831