Single chip process for sensors implementation, integration, and condition monitoring

Author

Cheng, C.-W. ; Liang, K.-C. ; Chu, C.-H. ; Horsley, David A. ; Fang, Wanliang

Author_Institution

Taiwan Semicond. Manuf. Co. (TSMC) Ltd., Hsinchu, Taiwan

fYear

2013

fDate

16-20 June 2013

Firstpage

730

Lastpage

733

Abstract

This study presents the development of a foundry available process scheme for MEMS devices. Such MEMS process scheme enables integration of various MEMS sensors with Pirani gauge. In applications, this study has employed such bulk Si with embedded poly plug process scheme to demonstrate various MEMS devices of different vacuum requirement, including resonators, accelerometer, gyroscope, and magnetometers on single Si wafer. Moreover, a monolithically integrated silicon-based Pirani vacuum gauge to provide in situ pressure monitor for each device is also demonstrated.

Keywords

condition monitoring; elemental semiconductors; microfabrication; microsensors; monolithic integrated circuits; pressure gauges; silicon; vacuum gauges; MEMS sensor device; Si; accelerometer; condition monitoring; embedded poly plug process scheme; foundry available process scheme; gyroscope; magnetometer; monolithically integrated silicon-based Pirani vacuum gauge; pressure monitoring; resonator; single chip process; vacuum requirement; Accelerometers; Gyroscopes; Magnetic sensors; Magnetometers; Micromechanical devices; Silicon; Accelerometer; Gyroscope; MEMS device integration; Magnetometers; Pirani gauge; Resonators;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on

Conference_Location

Barcelona

Type

conf

DOI

10.1109/Transducers.2013.6626870

Filename

6626870