• DocumentCode
    3456025
  • Title

    Exploring Talent Flow in Optics Valley of China

  • Author

    Hu, Bei ; Mao, Guanfeng ; Song, Hong ; Qian, Deping

  • Author_Institution
    Sch. of Manage., Huazhong Univ. of Sci. & Technol., Wuhan
  • fYear
    2008
  • fDate
    12-14 Oct. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In recent 20 years, the city of Wuhan has built a big high-tech industry cluster which is named Optics Valley of China. The Optics Valley of China is developing quickly, but scarcity of talent has become the bottleneck for its development. Recruiting talented worker is significant concern and the influence factors of talent flow have been explored. The questionnaire about influence factor of talent flow are designed and sent to 20 core enterprises at Optics Valley of China. 178 high-tech specialists returned the effective answer sheet. In the questionnaire survey, principal components analysis is used to explore the structure of this instrument, which suggests six components: working environment, industry cluster characteristic, urban environment, income, individual development, value and personality. The investigation result demonstrates the top three of these components are income, working environment, value and personality. The result verified the influence factor structure´s application in high-tech industry cluster, but it also shows the difference based on high-tech industry´s speciality.
  • Keywords
    innovation management; labour resources; China; Optics Valley; Wuhan city; high-tech industry cluster; principal components analysis; talent flow; working environment; Cities and towns; Communication industry; Humans; Image motion analysis; Lakes; Optical design; Production; Recruitment; Supply and demand; Technology management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Communications, Networking and Mobile Computing, 2008. WiCOM '08. 4th International Conference on
  • Conference_Location
    Dalian
  • Print_ISBN
    978-1-4244-2107-7
  • Electronic_ISBN
    978-1-4244-2108-4
  • Type

    conf

  • DOI
    10.1109/WiCom.2008.1669
  • Filename
    4679858