• DocumentCode
    3456204
  • Title

    Direct observation of damage accumulation process inside silicon under mechanical fatigue loading

  • Author

    Kamiya, Shinichiro ; Hirai, Riu ; Izumi, H. ; Umehara, N. ; Tokoroyama, T.

  • Author_Institution
    Nagoya Inst. of Technol., Nagoya, Japan
  • fYear
    2013
  • fDate
    16-20 June 2013
  • Firstpage
    784
  • Lastpage
    787
  • Abstract
    Fatigue test was performed on single crystal silicon under humid environment in an environmental scanning electron microscope. While the specimen was repeatedly subjected to compressive stress, electron beam induced current (EBIC) images were obtained to visualize damage evolution. Local contrast changes were successfully observed at the notch tip, which remained the same through the hydrofluoric acid treatment after the experiment. These facts suggest that damage evolved inside silicon crystal during the fatigue loading process and that the contrast change was not due to an oxide layer thickened on the surface.
  • Keywords
    compressive testing; dislocation etching; elemental semiconductors; fatigue; fatigue testing; scanning electron microscopy; silicon; EBIC; Si; compressive stress; damage accumulation process; electron beam induced current images; environmental scanning electron microscope; fatigue test; humid environment; hydrofluoric acid treatment; mechanical fatigue loading; notch tip; single crystal silicon; Compressive stress; Crystals; Fatigue; Loading; Silicon; Surface treatment; Defect; Dislocation; EBIC; Fatigue mechanism; Single crystalline silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/Transducers.2013.6626883
  • Filename
    6626883