DocumentCode
3456204
Title
Direct observation of damage accumulation process inside silicon under mechanical fatigue loading
Author
Kamiya, Shinichiro ; Hirai, Riu ; Izumi, H. ; Umehara, N. ; Tokoroyama, T.
Author_Institution
Nagoya Inst. of Technol., Nagoya, Japan
fYear
2013
fDate
16-20 June 2013
Firstpage
784
Lastpage
787
Abstract
Fatigue test was performed on single crystal silicon under humid environment in an environmental scanning electron microscope. While the specimen was repeatedly subjected to compressive stress, electron beam induced current (EBIC) images were obtained to visualize damage evolution. Local contrast changes were successfully observed at the notch tip, which remained the same through the hydrofluoric acid treatment after the experiment. These facts suggest that damage evolved inside silicon crystal during the fatigue loading process and that the contrast change was not due to an oxide layer thickened on the surface.
Keywords
compressive testing; dislocation etching; elemental semiconductors; fatigue; fatigue testing; scanning electron microscopy; silicon; EBIC; Si; compressive stress; damage accumulation process; electron beam induced current images; environmental scanning electron microscope; fatigue test; humid environment; hydrofluoric acid treatment; mechanical fatigue loading; notch tip; single crystal silicon; Compressive stress; Crystals; Fatigue; Loading; Silicon; Surface treatment; Defect; Dislocation; EBIC; Fatigue mechanism; Single crystalline silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location
Barcelona
Type
conf
DOI
10.1109/Transducers.2013.6626883
Filename
6626883
Link To Document