Title :
Carbon nanotube cvd-growth technology for future ULSI interconnects
Keywords :
Carbon nanotubes; Copper; Current density; Laboratories; Materials science and technology; Ohmic contacts; Temperature; Thermal conductivity; Thermal stresses; Ultra large scale integration;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2004. Digest of Papers. 2004 International
Print_ISBN :
4-99024720-5
DOI :
10.1109/IMNC.2004.245671
