• DocumentCode
    3456350
  • Title

    Power modeling and thermal management techniques for manycores

  • Author

    Nath, R. ; Carmean, Douglas ; Rosing, Tajana Simunic

  • Author_Institution
    Comput. Sci. & Eng., Univ. of California, San Diego, La Jolla, CA, USA
  • fYear
    2013
  • fDate
    7-10 July 2013
  • Abstract
    The rising number of cores in manycore architectures, along with technology scaling, results in high power densities and thermal issues on the die. To explore innovative thermal management techniques in such processors, we need an accurate online estimate of the power consumption. In this paper, we present the first ever power model for Intel many integrated core processors, which we use to show the benefit of a novel manycore specific thermal management technique called workload intermixing. Our proposed model leverages performance monitoring events and accounts for operating voltage and clock frequency. We validate our model for Intel Knights Ferry (KNF) design and show that we have an average of 4.73% prediction error vs. measurements. We provide the breakdown of total power into three main components: compute, memory, and interconnect and use it as an input for thermal management. Our simulation results show that our proposed intermixing of workloads in KNF architecture can reduce the total number of thermal emergency situations by 58% with energy savings of 14% on average.
  • Keywords
    energy conservation; microprocessor chips; multiprocessing systems; power aware computing; Intel Knights Ferry design; Intel many integrated core processors; KNF design; clock frequency; compute component; energy savings; interconnect component; manycore architectures; memory component; operating voltage; performance monitoring events; power consumption estimation; power densities; power model; power modeling techniques; technology scaling; thermal emergency situations; thermal issues; thermal management techniques; workload intermixing; Benchmark testing; Integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computers and Communications (ISCC), 2013 IEEE Symposium on
  • Conference_Location
    Split
  • Type

    conf

  • DOI
    10.1109/ISCC.2013.6755037
  • Filename
    6755037