Title :
Field emission from silicon microstructures formed by femtosecond laser assisted etching
Author :
Carey, J.E. ; Zhao, Lu ; Wu, Chunlin
Author_Institution :
Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
Abstract :
Summary form only given. Field-emission arrays have been extensively investigated for device applications such as flat panel displays, electron multipliers and microelectronics. The use of silicon structures as emitters is especially attractive due to the low cost and availability of silicon. Previously, our group reported the formation of sharp, micron-sized conical structures in quasi-ordered arrays after irradiating a silicon surface with hundreds of femtosecond-laser pulses in an atmosphere of SF/sub 6/. These conical microstructures exhibit sharp tips with a radius of curvature /spl sim/0.25 /spl mu/m and a subtended angle of less than 20/spl deg/. Emission currents suitable for applications and comparable with current standards are achieved with no further processing beyond the laser irradiation required to form our microstructures. We report on the field emission properties of these conical microstructures through analysis of the current-voltage characteristics and the Fowler-Nordheim plots obtained for various anodecathode separations.
Keywords :
cathodes; electron field emission; laser beam etching; laser beam machining; micromachining; silicon; vacuum microelectronics; Fowler-Nordheim plots; Si; conical microstructures; current-voltage characteristics; electron field emission; femtosecond laser assisted etching; field-emission arrays; micron-sized silicon-tip arrays; spike formation; stable emitters; Current-voltage characteristics; Etching; Laser beams; Laser theory; Linearity; Microstructure; Optical pulses; Silicon; Surface emitting lasers; Ultrafast electronics;
Conference_Titel :
Lasers and Electro-Optics, 2001. CLEO '01. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
1-55752-662-1
DOI :
10.1109/CLEO.2001.948159