• DocumentCode
    3457098
  • Title

    System design of a 3D integrated non-isolated Point Of Load converter

  • Author

    Ball, Arthur ; Lim, Michele ; Gilham, David ; Lee, Fred C.

  • Author_Institution
    Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA
  • fYear
    2008
  • fDate
    24-28 Feb. 2008
  • Firstpage
    181
  • Lastpage
    186
  • Abstract
    Thermal issues in the design of high-power and small-size non-isolated Point of Load (POL) converters have been significant and are becoming more so. If a heat sink is dispensed with, then a large area of multi-layer PCB material with significant amounts of copper is required for necessary cooling. A high-rate cooling fan is also necessary. So what at first seems like a small and elegant converter becomes bulky and challenging to position in the overall system when its thermal management is taken into account. This work finds a solution to these problems and investigates the use of Low- Temperature Co-fired Ceramic (LTCC) for integrating the inductor with the active stage. A buck POL is used to demonstrate these methodologies. The end result is a POL converter that can achieve full 20 A output current with no need for an external heat sink and no need for a cooling fan while providing a large step-down of 5 V to 1.2 V. High light- load efficiency of 92.2% is achieved and a high power density of 156 W/in3 including all the necessary thermal management, in natural convection condition, has been demonstrated.
  • Keywords
    cooling; fans; heat sinks; inductors; power convertors; thermal management (packaging); 3D integrated nonisolated point of load converter; heat sink; high-rate cooling fan; inductor; low-temperature co-fired ceramic; multilayer PCB material; natural convection condition; thermal management; Ceramics; Circuits; Cooling; Copper; Electronic packaging thermal management; Energy management; Heat sinks; Inductance; Switching frequency; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4244-1873-2
  • Electronic_ISBN
    1048-2334
  • Type

    conf

  • DOI
    10.1109/APEC.2008.4522719
  • Filename
    4522719