DocumentCode
3457123
Title
Competency-Related Pay on a Banding Platform: Creating a High-Performance
Author
Chen Weijing ; Yang Qing
Author_Institution
Sch. of Manage., Wuhan Univ. of Technol., Wuhan
fYear
2008
fDate
12-14 Oct. 2008
Firstpage
1
Lastpage
3
Abstract
In increasingly global and hyper competitive markets, to relate competencies and pay is a growing trend. This paper analyzes the key elements to link competence to pay. Establishes a model of an integrated approach to using competencies. Takes an example to show why it´s difficult to differentiate the ability of different researchers and motivate them by designing appropriate reward mechanism. And summarizes the primary criticism of competency pay.
Keywords
incentive schemes; banding platform; competency-related pay; competitive markets; Companies; Context modeling; Couplings; Educational institutions; Engineering profession; Joining processes; Life testing; Management training; Psychology; Technology management;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless Communications, Networking and Mobile Computing, 2008. WiCOM '08. 4th International Conference on
Conference_Location
Dalian
Print_ISBN
978-1-4244-2107-7
Electronic_ISBN
978-1-4244-2108-4
Type
conf
DOI
10.1109/WiCom.2008.1726
Filename
4679915
Link To Document