• DocumentCode
    3457123
  • Title

    Competency-Related Pay on a Banding Platform: Creating a High-Performance

  • Author

    Chen Weijing ; Yang Qing

  • Author_Institution
    Sch. of Manage., Wuhan Univ. of Technol., Wuhan
  • fYear
    2008
  • fDate
    12-14 Oct. 2008
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In increasingly global and hyper competitive markets, to relate competencies and pay is a growing trend. This paper analyzes the key elements to link competence to pay. Establishes a model of an integrated approach to using competencies. Takes an example to show why it´s difficult to differentiate the ability of different researchers and motivate them by designing appropriate reward mechanism. And summarizes the primary criticism of competency pay.
  • Keywords
    incentive schemes; banding platform; competency-related pay; competitive markets; Companies; Context modeling; Couplings; Educational institutions; Engineering profession; Joining processes; Life testing; Management training; Psychology; Technology management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Communications, Networking and Mobile Computing, 2008. WiCOM '08. 4th International Conference on
  • Conference_Location
    Dalian
  • Print_ISBN
    978-1-4244-2107-7
  • Electronic_ISBN
    978-1-4244-2108-4
  • Type

    conf

  • DOI
    10.1109/WiCom.2008.1726
  • Filename
    4679915