Title :
On-chip bondwire transformers for power SOC applications
Author :
Lu, Jian ; Jia, Hongwei ; Arias, Andres ; Gong, Xun ; Shen, Z. John
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL
Abstract :
In this paper, a novel concept of on-chip bondwire transformer with ferrite epoxy glob is proposed for power system on chip (SOC) applications. We have theoretically and experimentally proven the concept of the bondwire transformer and demonstrated that its performance can be improved using ferrite polymer epoxy glob. Transformer parameters including self- and mutual inductance, and coupling factors are extracted from both modeled and measured S-parameters. It is expected that the bondwire transformers can be easily integrated into power SOC manufacturing processes with minimal changes in processes, and open enormous possibilities for realizing cost- effective, high current, high efficiency power SOC´s.
Keywords :
power transformers; system-on-chip; coupling factors; ferrite polymer epoxy glob; mutual inductance; onchip bondwire transformers; power SOC applications; system on chip; Bonding; Ferrites; Inductance measurement; Mutual coupling; Polymers; Power system measurements; Power system modeling; Semiconductor device measurement; System-on-a-chip; Transformers; On-chip transformer; SOC; ferrite; wirebond;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-1873-2
Electronic_ISBN :
1048-2334
DOI :
10.1109/APEC.2008.4522722