Title :
High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging
Author :
Belsito, L. ; Ferri, M. ; Mancarella, F. ; Roncaglia, Alberto ; YAN, JIU DUN ; Seshia, Ashwin A. ; Soga, K.
Author_Institution :
Inst. of Microelectron. & Microsyst., Bologna, Italy
Abstract :
This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/με), very high resolution (4 nε), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.
Keywords :
chemical vapour deposition; chip scale packaging; dielectric resonators; silicon-on-insulator; steel; strain sensors; Si; bending tests; chip-level LPCVD vacuum packaging; chip-level vacuum packaging; compressive strain; high-resolution strain sensing; sensitivity; silicon-on-insulator flexural resonators; steel; tensile strain; Etching; Packaging; Resonant frequency; Sensors; Silicon-on-insulator; Steel; Strain; MEMS; SOI technology; Strain sensors; chip-level vacuum packaging; flexural resonators;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6626936
