DocumentCode
3457449
Title
Large displacement plastic deformation process for silicon parasol structure
Author
Aono, T. ; Ebata, Y. ; Matsui, Soya ; Watanabe, Toshio
Author_Institution
Hitachi Res. Lab., Hitachi, Ltd., Hitachi, Japan
fYear
2013
fDate
16-20 June 2013
Firstpage
1032
Lastpage
1035
Abstract
A large displacement silicon parasol structure has been realized using a developed two-step silicon plastic deformation process. This process consists of three key processes: first, plastic deformation at high temperature and applying a load from one side; second, two-step plastic deformation for large displacement and third, canopy release after plastic deformation. Accordingly, the silicon parasol structure with a diameter of 30 mm and a curvature radius of 100 mm can be fabricated by the developed plastic deformation process.
Keywords
elemental semiconductors; high-temperature techniques; plastic deformation; silicon; Si; canopy release; high temperature plastic deformation; large displacement plastic deformation process; silicon parasol structure; two-step plastic deformation; Fabrication; Lenses; Plastics; Shafts; Shape; Silicon; Substrates; Plastic deformation; silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location
Barcelona
Type
conf
DOI
10.1109/Transducers.2013.6626946
Filename
6626946
Link To Document