• DocumentCode
    3457449
  • Title

    Large displacement plastic deformation process for silicon parasol structure

  • Author

    Aono, T. ; Ebata, Y. ; Matsui, Soya ; Watanabe, Toshio

  • Author_Institution
    Hitachi Res. Lab., Hitachi, Ltd., Hitachi, Japan
  • fYear
    2013
  • fDate
    16-20 June 2013
  • Firstpage
    1032
  • Lastpage
    1035
  • Abstract
    A large displacement silicon parasol structure has been realized using a developed two-step silicon plastic deformation process. This process consists of three key processes: first, plastic deformation at high temperature and applying a load from one side; second, two-step plastic deformation for large displacement and third, canopy release after plastic deformation. Accordingly, the silicon parasol structure with a diameter of 30 mm and a curvature radius of 100 mm can be fabricated by the developed plastic deformation process.
  • Keywords
    elemental semiconductors; high-temperature techniques; plastic deformation; silicon; Si; canopy release; high temperature plastic deformation; large displacement plastic deformation process; silicon parasol structure; two-step plastic deformation; Fabrication; Lenses; Plastics; Shafts; Shape; Silicon; Substrates; Plastic deformation; silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/Transducers.2013.6626946
  • Filename
    6626946