Applications of new enhanced-pulse planar waveguide lasers in electronic substrate processing

Summary form only given. We have developed a new laser technology capable of peak/average power ratios of >35, and a /spl times/10 reduction in pulse duration, with no reduction in average power. This laser incorporates improved radiofrequency discharge stabilisation techniques permitting efficient pulsed electrical power transfer and the achievement of homogeneous laser-gain media at very high input power densities (/spl sim/800W/cm/sup -3/), corresponding to input peak power levels of 24 kW at elevated gas pressures (>200 Torr). We report the application of this new enhanced-pulse planar waveguide laser for the machining of electronic PCB substrate materials, including organic resins, metal foils, glasses and ceramic substrates.