Applications of new enhanced-pulse planar waveguide lasers in electronic substrate processing

Author

Markillie, G.A.J. ; Villarreal, F.J. ; Baker, H.J. ; Hall, D.R.

Author_Institution

Dept. of Phys., Heriot-Watt Univ., Edinburgh, UK

fYear

2001

fDate

11-11 May 2001

Firstpage

577

Lastpage

578

Abstract

Summary form only given. We have developed a new laser technology capable of peak/average power ratios of >35, and a /spl times/10 reduction in pulse duration, with no reduction in average power. This laser incorporates improved radiofrequency discharge stabilisation techniques permitting efficient pulsed electrical power transfer and the achievement of homogeneous laser-gain media at very high input power densities (/spl sim/800W/cm/sup -3/), corresponding to input peak power levels of 24 kW at elevated gas pressures (>200 Torr). We report the application of this new enhanced-pulse planar waveguide laser for the machining of electronic PCB substrate materials, including organic resins, metal foils, glasses and ceramic substrates.

Keywords

laser beam machining; printed circuit manufacture; substrates; 200 torr; 24 kW; PCB substrate materials; beam circularisation optics; ceramic substrates; efficient pulsed electrical power transfer; electronic substrate processing; enhanced-pulse planar waveguide lasers; glasses; homogeneous laser-gain media; material removal efficiency; melt ejection effects; metal foils; microvias drilling; organic resins; parameter dependence; radiofrequency discharge stabilisation; substrate machining; Gas lasers; Inorganic materials; Laser stability; Machining; Optical materials; Optical pulses; Planar waveguides; Power lasers; Radio frequency; Waveguide lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 2001. CLEO '01. Technical Digest. Summaries of papers presented at the Conference on

Conference_Location

Baltimore, MD, USA

Print_ISBN

1-55752-662-1

Type

conf

DOI

10.1109/CLEO.2001.948184

Filename

948184