DocumentCode :
3457705
Title :
An electrical circuit based 3-D thermal model of a fan cooled 600μH, 80A inductor for a plasma cutting power supply
Author :
Kamath, Girish R.
Author_Institution :
Hypertherm, Inc., Hanover, NH
fYear :
2008
fDate :
24-28 Feb. 2008
Firstpage :
402
Lastpage :
408
Abstract :
This paper applies a 3-D electrical circuit based thermal model technique described in [1] to analyze the thermal performance of a 600 muH, 80 A inductor for a plasma cutting application. The forced convective heat transfer terms in the model are derived using the empirical correlation method [2, 3]. This approach is cost-effective since it does not use an FEA tool for the analysis. Also, the circuit based nature of the model facilitates seamless coupling of the magnetic and thermal physics that affect the inductor in a standard circuit simulator environment. A comparative evaluation of the simulation results with experiment shows that the average coil temperature error is in the 10-12% range while the average layer temperature error is in the 3-16% range. This is lower than that seen in [1] where errors in the range 25-40% are recorded. However, the model has limitations due to the presence of individual winding layer temperature errors in the range 18-50%. Factors affecting the performance of the model are also discussed in the paper.
Keywords :
cutting; finite element analysis; forced convection; inductors; plasma applications; power supplies to apparatus; 3D thermal model; FEA tool; electrical circuit; fan cooled inductor; forced convective heat transfer; plasma cutting power supply; standard circuit simulator; Circuit simulation; Correlation; Heat transfer; Inductors; Magnetic circuits; Performance analysis; Plasma applications; Plasma temperature; Power supplies; Temperature distribution; Forced air cooling; empirical correlations; heat transfer coefficient; inductor; temperature rise; thermal modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
Conference_Location :
Austin, TX
ISSN :
1048-2334
Print_ISBN :
978-1-4244-1873-2
Electronic_ISBN :
1048-2334
Type :
conf
DOI :
10.1109/APEC.2008.4522753
Filename :
4522753
Link To Document :
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