Title :
Integration of bulk acoustic wave filters: concepts and trends
Author :
Elbrecht, L. ; Aigner, R. ; Lin, C.-I. ; Timme, H.-J.
Author_Institution :
Infineon Technol., Munich, Germany
Abstract :
The concepts and trends for the use of bulk acoustic wave (BAW) filters in tomorrow´s highly integrated RF front end components in mobile communication devices are discussed. We present examples for the integration of BAW filters into low-cost laminate-based modules and for the monolithic integration of solidly mounted bulk acoustic wave devices with bipolar integrated circuits. The options and limitation of the integration approaches are discussed.
Keywords :
BiCMOS integrated circuits; acoustic filters; bipolar integrated circuits; bulk acoustic wave devices; mobile communication; multichip modules; radiofrequency integrated circuits; BiCMOS integrated circuits; bipolar integrated circuits; bulk acoustic wave devices; bulk acoustic wave filter integration; integrated RF front end components; low-cost laminate-based modules; mobile communication devices; monolithic integration; multichip modules; solid mounting; Acoustic waves; Active filters; Ceramics; Monolithic integrated circuits; Packaging; Passive filters; Radio frequency; SAW filters; Switches; Transceivers;
Conference_Titel :
Microwave Symposium Digest, 2004 IEEE MTT-S International
Print_ISBN :
0-7803-8331-1
DOI :
10.1109/MWSYM.2004.1335905
