Integration of bulk acoustic wave filters: concepts and trends

Author

Elbrecht, L. ; Aigner, R. ; Lin, C.-I. ; Timme, H.-J.

Author_Institution

Infineon Technol., Munich, Germany

Volume

1

fYear

2004

fDate

6-11 June 2004

Firstpage

395

Abstract

The concepts and trends for the use of bulk acoustic wave (BAW) filters in tomorrow´s highly integrated RF front end components in mobile communication devices are discussed. We present examples for the integration of BAW filters into low-cost laminate-based modules and for the monolithic integration of solidly mounted bulk acoustic wave devices with bipolar integrated circuits. The options and limitation of the integration approaches are discussed.

Keywords

BiCMOS integrated circuits; acoustic filters; bipolar integrated circuits; bulk acoustic wave devices; mobile communication; multichip modules; radiofrequency integrated circuits; BiCMOS integrated circuits; bipolar integrated circuits; bulk acoustic wave devices; bulk acoustic wave filter integration; integrated RF front end components; low-cost laminate-based modules; mobile communication devices; monolithic integration; multichip modules; solid mounting; Acoustic waves; Active filters; Ceramics; Monolithic integrated circuits; Packaging; Passive filters; Radio frequency; SAW filters; Switches; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2004 IEEE MTT-S International

ISSN

0149-645X

Print_ISBN

0-7803-8331-1

Type

conf

DOI

10.1109/MWSYM.2004.1335905

Filename

1335905