Frequency characteristics of ultrasonic wire bonding using high frequency vibration systems of 40 kHz to 780 kHz

Author

Tsujino, Jiromaru ; Hasegawa, Koichi ; Sone, Yukio ; Nozaki, Koji

Author_Institution

Fac. of Eng., Kanagawa Univ., Yokohama, Japan

Volume

2

fYear

1996

fDate

3-6 Nov 1996

Firstpage

1021

Abstract

Welding characteristics of ultrasonic wire bonding for IC or LSI using 40 kHz to 780 kHz linear vibration welding systems are studied to improve the welding characteristics. Welding specimens used are soft and hard aluminum wires 0.1 mm and 0.03 mm in diameter, and copper plates 1.0 mm in thickness as a lower specimens. Frequency characteristics of required welding tip vibration amplitude and velocity for sufficient welding of these specimens are measured. Temperature rises at welding surface are measured by thermo-electric-motive force between aluminum and copper specimens and the maximum temperature measured is about 300 degrees centigrade

Keywords

lead bonding; ultrasonic welding; vibrations; 40 to 780 kHz; Al; Cu; IC; LSI; aluminum wire; copper plate; frequency characteristics; high frequency vibration system; temperature rise; thermo-electric-motive force; ultrasonic wire bonding; welding; Aluminum; Bonding; Copper; Force measurement; Frequency; Large scale integration; Temperature measurement; Vibration measurement; Welding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1996. Proceedings., 1996 IEEE

Conference_Location

San Antonio, TX

ISSN

1051-0117

Print_ISBN

0-7803-3615-1

Type

conf

DOI

10.1109/ULTSYM.1996.584166

Filename

584166