• DocumentCode
    3458657
  • Title

    Energy-Efficient Coverage Hole Self-Repair in Mobile Sensor Networks

  • Author

    Wu, Riheng ; He, Jun ; Li, Tiffany Jing ; Shi, Hongchi

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Univ. of Tennessee, Knoxville, TN, USA
  • fYear
    2009
  • fDate
    June 30 2009-July 2 2009
  • Firstpage
    1297
  • Lastpage
    1302
  • Abstract
    With the advancement of MEMS techniques, mobile sensors with low cost and high capability are being deployed widely to carry out all kinds of complicated, risky tasks in large scale networks, especially in the areas are inaccessible to the human. Mobile sensors, which have the function of self-detection and self-repair, are desirable to solve the problem of failure of sensors, which causes costly maintenance expenditure and fatal loss. In this paper, we propose a novel heuristic self-repair algorithm to fix coverage holes in sensor networks using mobile nodes. The algorithm works successfully and efficiently to cover holes using reasonable numbers of mobile sensors. Numerical simulation results show our algorithm is near optimal for small coverage holes in terms of the metrics in number of mobile sensors, time and space complexity compared to optimal scheme. Our scheme is especially suitable for repairing multiple irregular areas of coverage holes simultaneously.
  • Keywords
    computational complexity; mobile radio; numerical analysis; wireless sensor networks; MEMS techniques; energy-efficient coverage hole self-repair; heuristic self-repair algorithm; mobile nodes; mobile sensor networks; numerical simulation; self-detection; space complexity; time complexity; Computer networks; Computer science; Energy efficiency; Helium; Mobile computing; Network topology; Numerical simulation; Power engineering and energy; Power measurement; Robustness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    New Trends in Information and Service Science, 2009. NISS '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-0-7695-3687-3
  • Type

    conf

  • DOI
    10.1109/NISS.2009.249
  • Filename
    5260608