DocumentCode :
3458802
Title :
3D microfluidic cartridges by gas pressure assisted thermal bonding of microthermoformed films
Author :
Kosse, D. ; Schwemmer, F. ; Buselmeier, D. ; Zengerle, Roland ; von Stetten, F.
Author_Institution :
HSG-IMIT, Freiburg, Germany
fYear :
2013
fDate :
16-20 June 2013
Firstpage :
1318
Lastpage :
1321
Abstract :
Microthermoforming of film substrates is an emerging technology to form thin-walled microfluidic Lab-on-a-Chip cartridges. We present a process chain to fabricate thin-walled 3D microfluidic cartridges by thermally bonding a stack of microthermoformed polymer layers. The three layer bond stack comprises an upper and a lower microthermoformed film substrate separated by a flat intermediate film layer. For thermal bonding the films are pressed together by gas pressure, eliminating the need for any structure dependent tools. The capabilities of the process chain are demonstrated by bonding a complex microfluidic LabDisk demanding two stacked fluidic layers on top of each other.
Keywords :
bonding processes; lab-on-a-chip; microfluidics; polymers; LabDisk; gas pressure assisted thermal bonding; microthermoformed films; polymer layers; stacked fluidic layers; thin-walled 3D microfluidic cartridges; Bonding; Films; Liquids; Microfluidics; Substrates; Three-dimensional displays; 3D microfluidic cartridge; COC; Cyclic Olefine Copolymer; Gas pressure assisted bonding; Lab-on-a-Foil; Microfluidic LabDisk; SAXS-CD; Thermal bonding; co-extruded film;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
Type :
conf
DOI :
10.1109/Transducers.2013.6627019
Filename :
6627019
Link To Document :
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