• DocumentCode
    3458802
  • Title

    3D microfluidic cartridges by gas pressure assisted thermal bonding of microthermoformed films

  • Author

    Kosse, D. ; Schwemmer, F. ; Buselmeier, D. ; Zengerle, Roland ; von Stetten, F.

  • Author_Institution
    HSG-IMIT, Freiburg, Germany
  • fYear
    2013
  • fDate
    16-20 June 2013
  • Firstpage
    1318
  • Lastpage
    1321
  • Abstract
    Microthermoforming of film substrates is an emerging technology to form thin-walled microfluidic Lab-on-a-Chip cartridges. We present a process chain to fabricate thin-walled 3D microfluidic cartridges by thermally bonding a stack of microthermoformed polymer layers. The three layer bond stack comprises an upper and a lower microthermoformed film substrate separated by a flat intermediate film layer. For thermal bonding the films are pressed together by gas pressure, eliminating the need for any structure dependent tools. The capabilities of the process chain are demonstrated by bonding a complex microfluidic LabDisk demanding two stacked fluidic layers on top of each other.
  • Keywords
    bonding processes; lab-on-a-chip; microfluidics; polymers; LabDisk; gas pressure assisted thermal bonding; microthermoformed films; polymer layers; stacked fluidic layers; thin-walled 3D microfluidic cartridges; Bonding; Films; Liquids; Microfluidics; Substrates; Three-dimensional displays; 3D microfluidic cartridge; COC; Cyclic Olefine Copolymer; Gas pressure assisted bonding; Lab-on-a-Foil; Microfluidic LabDisk; SAXS-CD; Thermal bonding; co-extruded film;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/Transducers.2013.6627019
  • Filename
    6627019