DocumentCode
3458877
Title
Stanford University general purpose microelectrode fabrication process (neuroscience research application)
Author
Kovacs, Gregory T A ; Storment, Christopher W. ; Liang, David H. ; White, Robert L. ; Rosen, Joseph M.
Author_Institution
Dept. of Electr. Eng., Stanford Univ., CA, USA
fYear
1988
fDate
4-7 Nov. 1988
Firstpage
1651
Abstract
Microelectrode arrays have designed using standard CAD programs utilizing a construction-set approach. The microelectrode sites, interconnect metal lines, and bond pad areas are available as predefined cells that can be recombined easily to obtain various array geometries. The microelectrodes themselves are defined by choosing the appropriate opening sizes in the passivation layer over standard metal microelectrode pads. The fabrication process used for these arrays is easily implemented with standard integrated-circuit processing equipment. It can be used stand-alone to fabricate passive arrays or added to commercial integrated-circuit processes for active arrays. Microelectrode characterization and experimental results are presented.<>
Keywords
biological techniques and instruments; microassembling; microelectrodes; neurophysiology; CAD programs; active arrays; array geometry; bond pad areas; construction-set approach; experimental results; interconnect metal lines; microelectrode fabrication process; neuroscience research; passivation layer;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1988. Proceedings of the Annual International Conference of the IEEE
Conference_Location
New Orleans, LA, USA
Print_ISBN
0-7803-0785-2
Type
conf
DOI
10.1109/IEMBS.1988.94835
Filename
94835
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