• DocumentCode
    3459057
  • Title

    Circuit simulation model for a 100 A, 10 kV half-bridge SiC MOSFET/JBS power module

  • Author

    Duong, T.H. ; Rivera-López, A., Jr. ; Hefner, A.R. ; Ortiz-Rodríguez, J.M.

  • Author_Institution
    Semicond. Electron. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD
  • fYear
    2008
  • fDate
    24-28 Feb. 2008
  • Firstpage
    913
  • Lastpage
    917
  • Abstract
    This paper presents the simulation of a 100 A, 10 kV silicon carbide (SiC) half-bridge power module operating at 20 kHz in a behavioral boost converter circuit. In the half-bridge power module, 10 kV SiC power MOSFETs are used as the upper and lower switches, where 10 kV SiC junction barrier Schottky (JBS) anti-parallel diodes along with 100 V silicon JBS series reverse-blocking diodes are used to protect the SiC MOSFETs from reverse conduction. The behavioral boost converter is designed to operate a single power switch and a single power diode for continuous 20 kHz hard switching conditions at 5 kV and 100 A. The test circuit contains the model for the 100 A, 10 kV SiC half-bridge power module where the upper MOSFET gate is turned off. The simulated waveforms demonstrate fast switch performance (<100 ns) with minimal turn-on current spikes resulting from charging the capacitances of the other MOSFET and JBS diodes in the module. The results also indicate that the combination of the 10 kV SiC JBS anti-parallel diode with the series low-voltage silicon JBS reverse-blocking diode is effective in protecting the SiC MOSFETs from reverse conduction.
  • Keywords
    Schottky diodes; power MOSFET; power convertors; silicon compounds; wide band gap semiconductors; JBS power module; SiC; anti-parallel diodes; behavioral boost converter circuit; circuit simulation model; current 100 A; frequency 20 kHz; half-bridge SiC MOSFET; junction barrier Schottky; minimal turn-on current spikes; reverse conduction; reverse-blocking diodes; silicon carbide; voltage 10 kV; voltage 5 kV; Circuit simulation; Circuit testing; MOSFET circuits; Multichip modules; Power MOSFET; Protection; Schottky diodes; Silicon carbide; Switches; Switching converters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4244-1873-2
  • Electronic_ISBN
    1048-2334
  • Type

    conf

  • DOI
    10.1109/APEC.2008.4522830
  • Filename
    4522830