DocumentCode :
3459578
Title :
1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual
fYear :
1997
fDate :
8-10 April 1997
Abstract :
The following topics were dealt with. Device process; failure analysis; hot carriers; packaging; metallisation; compound semiconductors; optoelectronics; and ESD/latchup
Keywords :
electrostatic discharge; failure analysis; hot carriers; optoelectronic devices; semiconductor device metallisation; semiconductor device packaging; semiconductor device reliability; ESD; compound semiconductors; device process; failure analysis; hot carriers; latchup; metallisation; optoelectronics; packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1997. 35th Annual Proceedings., IEEE International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3575-9
Type :
conf
DOI :
10.1109/RELPHY.1997.584211
Filename :
584211
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3459578
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