Title :
A 6-DOF piezoelectric micro vibratory stage based on multi-axis distributed-electrode excitation of PZT/Si unimorph T-beams
Author :
Aktakka, Ethem E. ; Peterson, Rebecca L. ; Najafi, Khalil
Author_Institution :
Center for Wireless Integrated MicroSensing & Syst. (WIMS), Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
This paper reports the design, optimization, fabrication and preliminary testing of a six degree of freedom (6-DOF) multi-axis micro vibratory stage leveraging a new type of piezoelectric actuation based on distributed excitation electrodes and PZT/Si unimorph T-beams. This new design concept also allows both angular and linear bending actuation of a single piezoelectric unimorph with very large in-plane and out-of-plane displacements. The PZT/Si beam thickness ratio and width ratio are optimized, and the 6-DOF actuation modes are characterized via FEA. The vibratory stage is fabricated via a process that involves bonding/thinning of bulk-PZT over silicon features and includes PZT micro-patterning via an improved DRIE process. Preliminary tests show static displacement of ±1.0° for X/Y-tilting mode and ±22 μm for Z-translational mode, while the minimum resonance frequency is >0.9 kHz, and the maximum power consumption is <;250 μW. The presented device compares favorably with respect to previously reported multi-axis stages in terms of motion capability, displacement, size, input voltage and power consumption.
Keywords :
bonding processes; elemental semiconductors; finite element analysis; lead compounds; low-power electronics; microactuators; microelectrodes; piezoelectric actuators; silicon; sputter etching; 6-DOF piezoelectric microvibratory stage; DRIE process; PZT-Si; PZT-Si unimorph T-beams; angular bending actuation; bonding-thinning process; displacement; finite element analysis; input voltage; linear bending actuation; micropatterning; motion capability; multiaxis distributed-electrode excitation; multiaxis stage size; piezoelectric actuation; power consumption; Actuators; Electrodes; Fabrication; Power demand; Sensors; Silicon; Suspensions; Actuation; bonding; lapping; multi-axis; piezoelectric;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
Conference_Location :
Barcelona
DOI :
10.1109/Transducers.2013.6627085