Title :
Temperature cycling and thermal shock failure rate modeling
Author :
Blish, Richard C., II
Author_Institution :
Adv. Micro Devices Inc., Sunnyvale, CA, USA
Abstract :
Combining the Coffin-Manson formula with a lognormal distribution continues to be an effective method to model the effects of thermal stressing upon VLSI IC package reliability. This approach is applied to Thin Film Cracking (TFC) and several other failure mechanisms relevant to IC packages. The Coffin-Manson exponent, m, is found to lie in one of three relatively narrow ranges: m for ductile metal fatigue is ~1-3 m for commonly used IC metal alloys and intermetallics is ~3-5, while m for brittle fracture is ~6-8
Keywords :
VLSI; failure analysis; integrated circuit packaging; integrated circuit reliability; log normal distribution; reliability theory; thermal stress cracking; Coffin-Manson exponent; VLSI IC package reliability; brittle fracture; ductile fatigue; intermetallic; log-normal distribution; metal alloy; temperature cycling; thermal shock failure rate model; thermal stressing; thin film cracking; Electric shock; Failure analysis; Fatigue; Integrated circuit modeling; Integrated circuit packaging; Intermetallic; Temperature; Thermal stresses; Transistors; Very large scale integration;
Conference_Titel :
Reliability Physics Symposium, 1997. 35th Annual Proceedings., IEEE International
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3575-9
DOI :
10.1109/RELPHY.1997.584246
